Backend Semiconductor
Manufacturing
Flexciton’s dynamic APS technology brings adaptability, control, and intelligence to assembly, packaging, and test operations.
Bringing devices to life
In semiconductor manufacturing, the backend refers to the final stages of production, where the wafer is transformed into a functional chip ready for integration into electronic devices. This process encompasses:
Assembly
Attaching the die to a substrate and establishing electrical connections.
Packaging
Encasing the die to protect it from environmental factors and mechanical damage.
Test
Verifying the functionality and performance of the packaged chip.
A balancing act
Backend production is a balancing act of speed, quality, and flexibility. From urgent orders to yield risks and high product variety, manufacturers face constant complexity across assembly, packaging, and test.
On-Time Delivery
The complexity of the line, frequent setup changes, queue timers, and BoM make planning for on-time delivery (OTD) incredibly challenging.
Yield losses
To achieve yield targets, increasingly restrictive queue timer constraints are being placed over large sections of the line, while conservative queue timer scheduling leaves throughput on the table.
Throughput vs. cost
The prevalence of tool setup changes introduces a difficult trade-off between reducing cycle time for important customer orders, versus maintaining high overall throughput.
Transitioning to advanced packaging presents new challenges
The transition to advanced packaging is transforming back end semiconductor operations. Techniques like 3D stacking, wafer-level packaging, and system-in-package assembly add complexity whilst demanding expensive tools and fab-like production precision. Assembly lines are evolving into more controlled environments, where predictive maintenance, scheduling, and resource tracking are critical to ensure throughput, quality, and scalable growth.
Backend manufacturing demands dynamic and effective APS
Backend fabs face highly complex and dynamic challenges that humans and rule-based systems cannot solve effectively. Dynamic Advanced Planning & Scheduling (APS) is essential for quality, OTD, and meaningful decisions in complex, fast-changing environments.
Speak to an expertComplex setups
Tool changeovers that incorporate multiple resources with time scales varying from 30 minutes to 12 hours.
Tool utilisation
Idle or misallocated tools waste capacity; the APS must orchestrate workloads to maximise utilisation and throughput.
Bill of Materials
A complex BoM in backend manufacturing requires APS to optimize production, resources, and material flow efficiently.
Flexciton APS was designed
for dynamic environments
Backend manufacturing is dynamic by nature. When product mix, priorities, and constraints change, other systems struggle to keep up. Flexciton APS continuously adapts to live conditions, optimizing flow, throughput, and delivery performance — giving fabs full control and visibility over production outcomes.
Master operational complexity
Flexciton APS can schedule from the next few hours up to several weeks of production, optimize changeovers, dynamically manage WIP flow and optimize queue time loop management.
Control and visualise your production
Gain complete control over tradeoffs and visualise their impact on KPIs, simulate the next 7+ days to understand expected performance, visualise the next shift to see which lots will be loaded, and provide shopfloor teams with prioritised actions through their own UI.
Autonomous
Flexciton APS leverages AI and optimization to adaptively and dynamically optimize production with super-human intelligence, eliminating labor constraints created by manual systems.
Speak to one of our experts
Book a demo session or simply reach out to one of our experts to learn more about what Autonomous Technology could do for your fab.
